UV tape is applied in wafer grinding/cutting and the load processing of flexible electronic components.
Our UV tape is coated with a special strong adhesive to prevent wafers from dislodging during grinding or cutting.
Once the workpiece has been processed, a UV light can be introduced to break the adhesive bonds for clean and easy release.
Our UV tape is manufactured using a unique adhesive formula. It manifests superior adhesion capabilities to prevent workpieces from dislodging during cutting processes.
Our UV tape reduces wear on cutting blades, prolonging service life.
Our UV tape reacts instantaneously to UV light, maximizing work efficiency