陶瓷切割/研磨盤 (半導體用)

自動化移載、物件吸取、定位、精密網板印刷用工作台,利用孔洞透氣性陶瓷(氧化鋁或碳化矽)接上真空吸力,將工作物(包括晶圓、玻璃、PET 膜或其它薄型工作物)放置陶瓷工作吸盤上,利用真空吸力使工作物固定,進行清洗、切割、研磨、網版印刷及其它加工程序。
Our workstations are suitable for automated transfer, adhesion, positioning, and precision stencil printing. They are manufactured using porous, air-permeable ceramics (aluminum oxide or silicon carbide) and connected to a vacuum pump. Workpieces (e.g., wafers, glass, PET film, or other thin workpieces) are held down on the ceramic chuck by the pressure differential created by the vacuum pump, prepping the workpiece for cleaning, cutting, grinding, stencil printing, and other processes.

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多孔性陶瓷真空吸盤 (面板/光電業)

可吸附翹曲、鏤空工件、玻璃基板材料類型等作業物。
相較於傳統吸盤對於工件單一化規格吸附的特性,陶瓷真空吸盤的區域性吸附功能,有助於提升產線流暢度及其效能,亦可避免傳統吸盤易造成的刮傷及吸痕。
Our vacuum chucks are capable of holding warped/hollow workpieces and glass substrates.
Traditional chucks are typically manufactured to meet a single set of specifications. By comparison, our ceramic vacuum chucks offer regional adhesion. They are designed to enhance the continuity and efficiency of production lines while avoiding scratches and hold marks often produced by conventional chucks.

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氣浮載台 (面板/光電業)

非接觸式氣浮平台移載:
非接觸式輸送及移載設備主要為改善傳統搬運技術在玻璃基板變大之後所引發的問題,因為在輸送與移載過程中是不會直接接觸到作業物件,所以可以避免污染物附著、應力、靜電及損傷玻璃基板的情形發生,而多孔性材質(Porous material)可大幅降低氣體流量,還能達到氣墊層均勻氣壓及良好的分布並能提供足夠的作業所需漂浮高度。
Transfer using no-contact air floating tables:
No-contact conveyance and transfer equipment alleviate a number of transfer issues that have emerged as larger glass substrates are produced. In no-contact transfer and handling processes, the substrate is not exposed to the equipment, thereby avoiding substrate contamination, stress damage, and static electricity build-up. Moreover, the porous material drastically reduces airflow while creates an evenly distributed air cushion that can be adjusted to meet floating height requirements.

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UV TAPE

主要應用(Application):
晶片研磨、切割及軟性電子零件之承載加工。
塗佈特殊黏膠,具高黏著力,使晶片於研磨、切割過程不脫落、飛散。
加工結束後,照射紫外線,即變成不沾黏,容易取下而不殘膠。
Primary application:
UV tape is applied in wafer grinding/cutting and the load processing of flexible electronic components.
Our UV tape is coated with a special strong adhesive to prevent wafers from dislodging during grinding or cutting.
Once the workpiece has been processed, a UV light can be introduced to break the adhesive bonds for clean and easy release.

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最新資訊

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2018/9/20

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挾政府補貼衝擊面板市場,中國京東方計劃將戰線延至 OLED 市場

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