Our workstations are suitable for automated transfer, adhesion, positioning, and precision stencil printing. They are manufactured using porous, air-permeable ceramics (aluminum oxide or silicon carbide) and connected to a vacuum pump. Workpieces (e.g., wafers, glass, PET film, or other thin workpieces) are held down on the ceramic chuck by the pressure differential created by the vacuum pump, prepping the workpiece for cleaning, cutting, grinding, stencil printing, and other processes.
Our vacuum chucks are capable of holding warped/hollow workpieces and glass substrates.
Traditional chucks are typically manufactured to meet a single set of specifications. By comparison, our ceramic vacuum chucks offer regional adhesion. They are designed to enhance the continuity and efficiency of production lines while avoiding scratches and hold marks often produced by conventional chucks.
Transfer using no-contact air floating tables:
No-contact conveyance and transfer equipment alleviate a number of transfer issues that have emerged as larger glass substrates are produced. In no-contact transfer and handling processes, the substrate is not exposed to the equipment, thereby avoiding substrate contamination, stress damage, and static electricity build-up. Moreover, the porous material drastically reduces airflow while creates an evenly distributed air cushion that can be adjusted to meet floating height requirements.
UV tape is applied in wafer grinding/cutting and the load processing of flexible electronic components.
Our UV tape is coated with a special strong adhesive to prevent wafers from dislodging during grinding or cutting.
Once the workpiece has been processed, a UV light can be introduced to break the adhesive bonds for clean and easy release.